Introduction to RT/duroid 5880
The RT/duroid 5880 is a high-frequency laminate that combines PTFE with glass microfibers. This composite material is engineered for precise stripline and microstrip circuit applications, offering unparalleled dielectric constant uniformity across different panels. The randomly oriented microfibers contribute to this uniformity, ensuring consistent performance across a wide frequency range. With a low dissipation factor, RT/duroid 5880 is particularly effective for applications extending into the Ku-band and beyond, making it an essential component in modern electronic designs.
Key Features
The RT/duroid 5880 PCB is characterized by several notable features:
Dielectric Constant: A consistent value of 2.2, with a tight tolerance of 0.02 at 10 GHz / 23°C, ensures reliable signal propagation.
Dissipation Factor: An exceptionally low dissipation factor of 0.0009 at 10 GHz minimizes energy loss, enhancing the efficiency of high-frequency circuits.
Temperature Coefficient of Dielectric Constant (TCDk): With a TCDk of -125 ppm/°C, the PCB maintains stable performance across a range of temperatures.
Moisture Absorption: A low moisture absorption rate of just 0.02% makes this PCB ideal for high-moisture environments, preventing degradation over time.
Isotropic Properties: The PCB exhibits isotropic behavior, with a coefficient of thermal expansion (CTE) of 31 ppm/°C along the X-axis, 48 ppm/°C along the Y-axis, and 237 ppm/°C along the Z-axis.
| RT/duroid 5880 Typical Value |
| Property | RT/duroid 5880 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 2.20
2.20±0.02 spec. | Z | N/A | C24/23/50
C24/23/50 | 1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5 |
| Dielectric Constant,εDesign | 2.2 | Z | N/A | 8GHz to 40 GHz | Differential Phase Length Method |
| Dissipation Factor,tanδ | 0.0004
0.0009 | Z | N/A | C24/23/50
C24/23/50 | 1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5 |
| Thermal Coefficient of ε | -125 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 2 x 107 | Z | Mohm cm | C/96/35/90 | ASTM D 257 |
| Surface Resistivity | 3 x 107 | Z | Mohm | C/96/35/90 | ASTM D 257 |
| Specific Heat | 0.96(0.23) | N/A | j/g/k
(cal/g/c) | N/A | Calculated |
| Tensile Modulus | Test at 23℃ | Test at 100℃ | N/A | MPa(kpsi) | A | ASTM D 638 |
| 1070(156) | 450(65) | X |
| 860(125) | 380(55) | Y |
| Ultimate Stress | 29(4.2) | 20(2.9) | X |
| 27(3.9) | 18(2.6) | Y |
| Ultimate Strain | 6 | 7.2 | X | % |
| 4.9 | 5.8 | Y |
| Compressive Modulus | 710(103) | 500(73) | X | MPa(kpsi) | A | ASTM D 695 |
| 710(103) | 500(73) | Y |
| 940(136) | 670(97) | Z |
| Ultimate Stress | 27(3.9) | 22(3.2) | X |
| 29(5.3) | 21(3.1) | Y |
| 52(7.5) | 43(6.3) | Z |
| Ultimate Strain | 8.5 | 8.4 | X | % |
| 7.7 | 7.8 | Y |
| 12.5 | 17.6 | Z |
| Moisture Absorption | 0.02 | N/A | % | 0.62"(1.6mm) D48/50 | ASTM D 570 |
| Thermal Conductivity | 0.2 | Z | W/m/k | 80℃ | ASTM C 518 |
| Coefficient of Thermal Expansion | 31
48
237 | X
Y
Z | ppm/℃ | 0-100℃ | IPC-TM-650 2.4.41 |
| Td | 500 | N/A | ℃ TGA | N/A | ASTM D 3850 |
| Density | 2.2 | N/A | gm/cm3 | N/A | ASTM D 792 |
| Copper Peel | 31.2(5.5) | N/A | Pli(N/mm) | 1oz(35mm)EDC foil
after solder float | IPC-TM-650 2.4.8 |
| Flammability | V-0 | N/A | N/A | N/A | UL 94 |
| Lead-free Process Compatible | Yes | N/A | N/A | N/A | N/A |
Benefits
The RT/duroid 5880 PCB offers numerous advantages that enhance its appeal for various applications:
Uniform Electrical Properties: Consistent electrical performance is achieved across a wide frequency range, ensuring reliability in demanding applications.
Machinability: The material can be easily cut, sheared, and machined, allowing for flexibility in design and manufacturing processes.
Chemical Resistance: Resistance to solvents and reagents typically used in PCB fabrication enhances durability and longevity.
Ideal for Moist Environments: The low moisture absorption rate makes it suitable for applications in high-humidity settings, where other materials may fail.
Proven Reliability: Recognized as a well-established material, RT/duroid 5880 is known for its low electrical loss among reinforced PTFE materials.
PCB Construction and Specifications
The RT/duroid 5880 2-Layer Rigid PCB is constructed with precision and attention to detail:
Stackup: The PCB features two copper layers (35 μm each) encompassing a core of RT/duroid 5880 that measures 0.254 mm (10 mil).
Board Dimensions: The dimensions are set at 50 mm x 45 mm, with a tolerance of ±0.15 mm, facilitating integration into various designs.
Minimum Trace/Space: A minimum trace and space of 5/4 mils allows for high-density designs without compromising performance.
Minimum Hole Size: A minimum hole size of 0.2 mm supports a variety of component footprints.
Finished Thickness: The finished board thickness is 0.4 mm, with an outer copper weight of 1 oz (1.4 mils).
Surface Finish: Immersion gold is applied, ensuring excellent electrical performance and protection against environmental factors.
Silkscreen and Solder Mask: The top silkscreen is printed in white, while the top solder mask is matte green; no bottom silkscreen or solder mask is included.
Vias: The PCB includes a total of 42 vias, with copper filling on designated IC pads.
Testing: A rigorous 100% electrical testing is conducted prior to shipment to ensure functionality and reliability.
Quality Assurance
To maintain high standards, the RT/duroid 5880 PCB adheres to IPC-Class-2 quality standards. This commitment to quality ensures that customers receive a product that meets stringent performance requirements.
Typical Applications
This PCB is deemed suitable for a range of applications, including:
Commercial Airline Broadband Antennas
Microstrip and Stripline Circuits
Millimeter Wave Applications
Radar Systems
Guidance Systems
Point-to-Point Digital Radio Antennas
The RT/duroid 5880 2-Layer Rigid PCB is positioned as a high-performance, reliable solution designed to meet the rigorous demands of modern electronic applications.
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10mil RT duroid 5880 PCB Dual Layer Copper Filled Via Images
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