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RF-35TC 0.8mm RF PCB Board

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RF-35TC 0.8mm RF PCB Board

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Brand Name : Bicheng

Model Number : BIC-026.V1.0

Certification : UL, ISO9001, IATF16949

Place of Origin : CHINA

MOQ : 1PCS

Price : USD9.99-99.99

Payment Terms : T/T

Supply Ability : 5000PCS per month

Delivery Time : 8-9 working days

Packaging Details : Vacuum bags+Cartons

Base material : RF-35TC

Layer count : 2 layers

PCB size : 90 x 45mm=1PCS

PCB thickness : 0.8mm

Solder mask : Green

Silkscreen : White

Copper weight : 1oz

Surface finish : ENIG

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Taconic High Frequency PCB Built on RF-35TC 30mil 0.762mm With Black Solder Mask for Antennas

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

RF-35TC is a type of high frequency material from Taconic company. It offers a "best in class" low dissipation factor with high thermal conductivity. This material is best suited for high power applications where every 1/10th of a dB is critical and the PCB substrate is expected to diffuse heat away from both transmission lines and surface mount components such as transistors.

RF-35TC is a PTFE based, ceramic filled fiberglass substrate. It will not oxidize, yellow or show upward drift in dielectric constant and dissipation factor like its synthetic rubber (hydrocarbon) competitors.

This laminate has a low dielectric constant value of 3.50 and has extremely low Df of 0.0011. It provides a low dissipation factor with high thermal conductivity and bonds very well to low profile copper, further reducing insertion loss.

Antennas, satellites, filters, couplers, and power amplifiers find the RF-35TC laminates to be the perfect fit.

PCB Specifications

PCB SIZE 90 x 45mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 35um(1 oz)+plate TOP layer
RF-35TC 0.762mm
copper ------- 35um(1oz) + plate BOT Layer
TECHNOLOGY
Minimum Trace and Space: 4 mil / 5 mil
Minimum / Maximum Holes: 0.4 mm / 5.5 mm
Number of Different Holes: 9
Number of Drill Holes: 21
Number of Milled Slots: 1
Number of Internal Cutouts: 1
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL
Glass Epoxy: RF-35TC 0.762mm
Final foil external: 1.5 oz
Final foil internal: N/A
Final height of PCB: 0.8 mm ±0.1
PLATING AND COATING
Surface Finish ENIG
Solder Mask Apply To: TOP, 12micron Minimum
Solder Mask Color: Green, PSR-2000GT600D, Taiyo Supplied.
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend TOP
Colour of Component Legend White, IJR-4000 MW300, Taiyo brand
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA Plated through hole(PTH), minimum size 0.4mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

RF-35TC 0.8mm RF PCB Board

Data Sheet of RF-35TC

RF-35TC TYPICAL VALUES
Property Test Method Unit Value Unit Value
DK @10 GHz IPC-650 2.5.5.5.1(modified) 3.5 3.5
Tck(-30 to 120℃) IPC-650 2.5.5.5.1(modified) ppm 24 ppm 24
Df @10 GHz IPC-650 2.5.5.5.1(modified) 0.0011 0.0011
Dielectric Breakdown IPC-650 2.5.6(in-Plane,Two Pins in Oil) kV 56.7 kV 56.7
Dielectric Strength ASTM D 149(Through Plane) V/mil 570 V/mm 22,441
Arc Resistance IPC-650 2.5.1 Seconds 304 Seconds 304
Moisture Absorption IPC-650 2.6.2.1 % 0.05 % 0.05
Flexural Strength(MD) ASTM D 790/IPC-650 2.4.4 psi 12,900 N/mm2 88.94
Flexural Strength(CD) ASTM D 790/IPC-650 2.4.4 psi 11,700 N/mm2 80.67
Tensile Strength(MD) ASTM D 3039/IPC-TM-650 2.4.19 psi 9,020 N/mm2 62.19
Tensile Strength(CD) ASTM D 3039/IPC-TM-650 2.4.19 psi 7,740 N/mm2 53.37
Elongation at Break(MD) ASTM D 3039/IPC-TM-650 2.4.19 % 1.89 N/mm 1.89
Elongation at Break(CD) ASTM D 3039/IPC-TM-650 2.4.19 % 1.7 % 1.7
Young's Modulus(MD) ASTM D 3039/IPC-TM-650 2.4.19 psi 667,000 N/mm2 4,599
Young's Modulus(CD) ASTM D 3039/IPC-TM-650 2.4.19 psi 637,000 N/mm2 4,392
Poisson's Ratio(MD) ASTM D 3039/IPC-TM-650 2.4.19 0.18 0.18
Poisson's Ratio(CD) ASTM D 3039/IPC-TM-650 2.4.19 0.23 0.18
Compressive Modulus ASTM D 695(23℃) psi 560,000 N/mm2 3,861
Flexural Strength(MD) ASTM D 790/IPC-650 2.4.4 psi 1.46 x 106 N/mm2 10,309
Flexural Strength(CD) ASTM D 790/IPC-650 2.4.4 psi 1.50 x 106 N/mm2 10,076
Peel Stength(½ oz.CVH) IPC-650 2.4.8(Thermal Stress.) Ibs./inch 7 g/cm3 1.25
Thermal Conductivity(Unclad,125℃) ASTM F433(Guarded Heat Flow) W/(mK) 0.6 W/(mK) 0.6
Thermal Conductivity(C1/C1,125℃) ASTM F433(Guarded Heat Flow) W/(mK) 0.92 W/(mK) 0.92
Thermal Conductivity(CH/CH,125℃) ASTM F433(Guarded Heat Flow) W/(mK) 0.87 W/(mK) 0.87
Dimensional Stability(MD) IPC-650-2.4.39 Sec.5.4(After Etch) mils/in. 0.23 mm/M 0.23
Dimensional Stability(CD) IPC-650-2.4.39 Sec.5.4(After Etch) mils/in. 0.64 mm/M 0.64
Dimensional Stability(MD) IPC-650-2.4.39 Sec.5.5(Thermal Stress.) mils/in. -0.04 mm/M -0.04
Dimensional Stability(CD) IPC-650-2.4.39 Sec.5.5(Thermal Stress.) mils/in. 0.46 mm/M 0.46
Surface Resistivity IPC-650 2.5.17.1(after elevated temp.) Mohms 8.33 x 107 Mohms 8.33 x 107
Surface Resistivity IPC-650 2.5.17.1(after humidity) Mohms 6.42 x 107 Mohms 6.42 x 107
Volume Resistivity IPC-650 2.5.17.1(after elevated temp.) Mohms/cm 5.19 x 108 Mohms/cm 5.19 x 108
Volume Resistivity IPC-650 2.5.17.1(after humidity) Mohms/cm 2.91 x 108 Mohms/cm 2.91 x 108
CTE(X axis)(25-260℃) IPC-650 2.4.41/ASTM D 3386 ppm/℃ 11 ppm/℃ 11
CTE(Y axis)(25-260℃) IPC-650 2.4.41/ASTM D 3386 ppm/℃ 13 ppm/℃ 13
CTE(Z axis)(25-260℃) IPC-650 2.4.41/ASTM D 3386 ppm/℃ 34 ppm/℃ 34
Density ASTM D 792 g/cm3 2.35 g/cm3 2.35
Hardness ASTM D 2240(Shore D) 79.1 79.1
Strain at Break(MD) ASTM D 790/IPC-650 2.4.4 % 0.014 % 0.014
Strain at Break(CD) ASTM D 790/IPC-650 2.4.4 % 0.013 % 0.013
Specific Heat ASTM E 1269-05,E 967-08,E968-02 j/(g℃) 0.94 j/(g℃) 0.94
Td(2% Weight Loss) IPC-650 2.4.24.6/TGA oF 788 ℃ 420
Td(5% Weight Loss) IPC-650 2.4.24.6/TGA oF 817 ℃ 436

RF-35TC 0.8mm RF PCB Board


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