Introducing our newly shipped 8-layer PCB, expertly designed for high-frequency applications and engineered with a combination of RO4003C and FR-4 materials. This advanced PCB is ideal for a variety of industries, including telecommunications, automotive, and aerospace, offering superior performance in demanding environments.
Key Properties of RO4003C:
Dielectric Constant (Dk): 3.38 ± 0.05 at 10 GHz
Dissipation Factor: 0.0027 at 10 GHz
Thermal Conductivity: 0.71 W/m/°K
CTE: Matched to copper with X axis of 11 ppm/°C and Y axis of 14 ppm/°C
Tg: >280 °C
Low Moisture Absorption: 0.06%
| Property | RO4003C | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.38±0.05 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign | 3.55 | Z | | 8 to 40 GHz | Differential Phase Length Method |
| Dissipation Factortan,δ | 0.0027
0.0021 | Z | | 10 GHz/23℃
2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | +40 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.7 x 1010 | | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 |
| Surface Resistivity | 4.2 x 109 | | MΩ | COND A | IPC-TM-650 2.5.17.1 |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 19,650(2,850)
19,450(2,821) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 139(20.2)
100(14.5) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 276
(40) | | MPa
(kpsi) | | IPC-TM-650 2.4.4 |
| Dimensional Stability | <0.3 | X,Y | mm/m
(mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 11
14
46 | X
Y
Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | | ℃ TMA | A | IPC-TM-650 2.4.24.3 |
| Td | 425 | | ℃ TGA | | ASTM D 3850 |
| Thermal Conductivity | 0.71 | | W/M/oK | 80℃ | ASTM C518 |
| Moisture Absorption | 0.06 | | % | 48hrs immersion 0.060"
sample Temperature 50℃ | ASTM D 570 |
| Density | 1.79 | | gm/cm3 | 23℃ | ASTM D 792 |
| Copper Peel Stength | 1.05
(6.0) | | N/mm
(pli) | after solder float 1 oz.
EDC Foil | IPC-TM-650 2.4.8 |
| Flammability | N/A | | | | UL 94 |
| Lead-free Process Compatible | Yes | | | | |
Features of S1000-2M Material
Incorporated within this PCB is S1000-2M material, noted for its high thermal resistance and reliability.
Key Properties of S1000-2M:
Low Z-axis CTE: 2.4 ppm/°C
High Tg: 185 °C
Low Water Absorption: 0.08%
UL 94-V0 Rating: Ensuring compliance with flammability standards.
Basic Specifications
Board Type: 8 Layers
Material Composition: RO4003C + FR-4 Tg170°C
Solder Mask: Green on both sides
Silkscreen Print: White on the top side
Surface Finish: ENIG (Electroless Nickel Immersion Gold)
Total Board Thickness: 1.5 mm ± 10%
Board Size: 87.5 mm x 40.6 mm (1 PCS)
Minimum Hole Size: 0.2 mm
Solder Mask Thickness: 10 μm
Minimum Dielectric Thickness: 100 μm
Minimum Trace Line Width: 115 μm
Minimum Spacing: 135 μm
Blind Vias: Yes (L1-L2, L7-L8)
Buried Vias: Yes (L2-L7)
Back Drilled Vias: Yes (L1-L6)
Impedance Control
The PCB is designed with controlled impedance features, including:
50 Ohm Differential Pairs: Top layer, 4 mil trace/gap with reference layer 2
100 Ohm Differential Pairs: Top layer, 5 mil trace/gap with reference layer 2
50 Ohm Single End: Top layer, 6 mil trace with reference layer 2
All 0.3 mm vias are filled and capped according to IPC 4761 Type VII, ensuring robust connectivity. Edge plating is also included, enhancing the board's durability and performance.
Artwork and Quality Standards
The artwork for this PCB has been supplied in the Gerber RS-274-X format, facilitating seamless integration into existing manufacturing processes. Compliance with IPC-Class-2 standards has been ensured during manufacturing, guaranteeing reliable performance and quality.
Typical Applications
The versatility of this PCB makes it suitable for a wide range of applications, including:
Cellular Base Station Antennas and Power Amplifiers
RF Identification Tags
Automotive Radar and Sensors
LNBs for Direct Broadcast Satellites
Computing, Communication, and Automotive Electronics
Conclusion
The newly shipped 8-layer RO4003C + FR-4 PCB stands out as a premium solution for high-frequency applications, combining advanced materials and meticulous engineering. Designed to meet the demands of modern electronics, this PCB is ready to support project needs across various industries. For further inquiries or to place an order, contact us today!
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HDI Hybrid PCB 8-Layer 1.5mm On RO4003C And S10002M Materials Images
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