We are excited to introduce our newly shipped 2-layer printed circuit board (PCB) featuring RF-60TC, a high-frequency laminate designed for high-power RF and microwave applications. This advanced material combines ceramic-filled, glass-reinforced PTFE with exceptional thermal conductivity, making it ideal for miniaturized antenna designs and other high-efficiency applications.
Key Features
RF-60TC boasts a dielectric constant (Dk) of 6.15 at 10 GHz and a low dissipation factor of 0.002, providing improved gains and efficiencies in RF circuits. Its high thermal conductivity—1.0 W/m*K for 0.5 oz copper and 1.05 W/m*K for 1 oz—ensures effective heat dissipation, reducing operating temperatures and enhancing the reliability of active components. Additionally, RF-60TC has a low moisture absorption rate of 0.03% and a thermal coefficient of Dk of -3.58 ppm/°C, ensuring stable performance across a wide temperature range.
| Property | Test Method | Unit | Value | Unit | Value |
| Dk @ 10 GHz | IPC-650 2.5.5.5.1 (Modified) | | 6.15 ± 0.15 | | 6.15 ± 0.15 |
| Df @ 10 GHz | IPC-650 2.5.5.5.1 (Modified) | | 0.002 | | 0.002 |
| TcK | | ppm/°C | -3.581 | ppm/°C | -3.581 |
| Dielectric Breakdown | IPC-650 2.5.6 | kV | 55 | kV | 55 |
| Dielectric Strength | IPC-650 2.5.6.2 | V/mil | 550 | V/mm | 21,654 |
| Arc Resistance | IPC-650 2.5.1 | Seconds | >180 | Seconds | >180 |
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.03 | % | 0.03 |
| Flexural Strength (MD) | IPC-650 2.4.4 | psi | 10,000 | N/mm2 | 69 |
| Flexural Strength (CD) | IPC-650 2.4.4 | psi | 9,000 | N/mm2 | 62 |
| Tensile Strength (MD) | IPC-650 2.4.19 | psi | 9,000 | N/mm2 | 62 |
| Tensile Strength (CD) | IPC-650 2.4.19 | psi | 7,000 | N/mm2 | 48 |
| Young’s Modulus (MD) | ASTM D 3039/IPC-TM-650 2.4.19 | kpsi | 721 | N/mm2 | 4971 |
| Poisson’s Ratio (MD) | ASTM D 3039/IPC-TM-650 2.4.19 | | 0.155 | | 0.155 |
| Peel Strength (1 oz. ED) | IPC-650 2.4.8 | lbs/in | 8 | N/mm | 1.43 |
| Thermal Conductivity (Unclad) | IPC-650 2.4.50 | W/M*K | 0.9 | W/M*K | 0.9 |
| Thermal Conductivity (CH/CH) | IPC-650 2.4.50 | W/M*K | 1 | W/M*K | 1 |
| Thermal Conductivity (C1/C1) | IPC-650 2.4.50 | W/M*K | 1.05 | W/M*K | 1.05 |
| Dimensional Stability (MD) | IPC-650 2.4.39 Sec. 5.4 (After Bake) | mils/in | 0.01 | mm/M | 0.01 |
| Dimensional Stability (CD) | IPC-650 2.4.39 Sec. 5.4 (After Bake) | mils/in | 0.69 | mm/M | 0.69 |
| Dimensional Stability (MD) | IPC-650 2.4.39 Sec. 5.5 (Thermal Stress) | mils/in | 0.06 | mm/M | 0.06 |
| Dimensional Stability (CD) | IPC-650 2.4.39 Sec. 5.5 (Thermal Stress) | mils/in | 0.8 | mm/M | 0.8 |
| Surface Resistivity | IPC-650 2.5.17.1 (After Humidity) | Mohm | 1.0 x 108 | Mohm | 1.0 x 108 |
| Volume Resistivity | IPC-650 2.5.17.1 (After Humidity) | Mohm/cm | 1.0 x 108 | Mohm/cm | 1.0 x 108 |
| CTE (X, Y axis) | IPC-650 2.4.41 (RT- 150 °C) | ppm/°C | 9.9 | ppm/°C | 9.9 |
| CTE (Z axis) | IPC-650 2.4.41 (RT- 150 °C) | ppm/°C | 40 | ppm/°C | 40 |
| Density (Specific Gravity) | IPC-650 2.3.5 | g/cm3 | 2.84 | g/cm3 | 2.84 |
| Specific Heat | IPC-650 2.4.50 | J/gK | 0.94 | J/gK | 0.94 |
| Td (2% Wt. Loss) | IPC - 650 2.4.24.6 / TGA | °F | 930 | °C | 500 |
| Td (5% Wt. Loss) | IPC - 650 2.4.24.6 / TGA | °F | 960 | °C | 515 |
| Flammability Rating | UL 94 | | V-0 | | V-0 |
PCB Specifications
This PCB features a robust stackup consisting of:
- Copper Layer 1: 35 μm
- RF-60TC Core: 0.254 mm (10 mil)
- Copper Layer 2: 35 μm
The overall dimensions of the PCB are 49.44 mm x 36.88 mm ± 0.15 mm, with a finished thickness of 0.37 mm. It supports a minimum trace/space of 4/5 mils and a minimum hole size of 0.25 mm. The PCB is designed without blind vias, featuring a finished copper weight of 1 oz (1.4 mils) on both outer layers.
For surface finish, the PCB uses immersion tin, and it has a white silkscreen on the top side, while the bottom remains clear of silkscreen and solder mask. Each PCB undergoes 100% electrical testing prior to shipment to ensure optimal performance.
| PCB Material: | PTFE based, ceramic filled fiberglass |
| Designation: | RF-60TC |
| Dielectric constant: | 6.15 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm) |
| PCB thickness: | 10mil (0.254mm); 20mil (0.508mm), 25mil(0.635mm); 30mil (0.762mm), 60mil (1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc.. |
Applications
This versatile PCB is suitable for a range of applications, including:
- High Power Amplifiers
- Miniaturized Antennas
- GPS, Patch, RFID Readers
- Filters, Couplers, and Dividers
- Satellite Components
Quality Assurance and Availability
This PCB is produced in accordance with IPC-Class 2 standards and is available for global shipping. The artwork is supplied in Gerber RS-274-X format, ensuring it is compatible with standard PCB design workflows.
Utilizing RF-60TC material allows you to attain superior performance and reliability in high-frequency applications, making it an ideal option for sophisticated RF circuit designs.
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RF-60TC PCB 10mil 2 Layer Immersion Tin Circuit Board Images
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