The DiClad 880 PCB is crafted from Rogers' advanced woven fiberglass reinforced, PTFE-based composites, specifically designed to provide a lower dielectric constant for printed circuit board substrates. With precise control over the fiberglass/PTFE ratio, DiClad 880 laminates not only achieve a lower dielectric constant and dissipation factor but also offer enhanced dimensional stability. The unique woven fiberglass reinforcement in DiClad 880 ensures greater stability compared to nonwoven fiberglass reinforced PTFE laminates with similar dielectric properties, making it an ideal choice for high-performance applications.
Key Features
The DiClad 880 exhibits a dielectric constant (Dk) of 2.17 or 2.2, with a tolerance of +/- 0.04 at frequencies of 10 GHz and 23°C, as well as at 1 MHz. Its dissipation factor is impressively low, measuring at 0.0009 at 10 GHz and 0.0008 at 1 MHz, contributing to its efficiency.
Additionally, the temperature coefficient of dielectric constant (TcDK) is -160 ppm/°C, maintaining stability across a temperature range of -10°C to 140°C. With a moisture absorption rate of just 0.02%, DiClad 880 outperforms many PTFE-based composites. The coefficient of thermal expansion (CTE) values are 25 ppm/°C in the X-axis, 34 ppm/°C in the Y-axis, and 252 ppm/°C in the Z-axis. This laminate also meets UL 94-V0 flammability standards, ensuring safety in various applications.
| Property | Test Method | Condition | DiClad 880 |
| Dielectric Constant @ 10 GHz | IPC TM-650 2.5.5.5 | C23/50 | 2.17, 2.20 |
| Dielectric Constant @ 1 MHz | IPC TM-650 2.5.5.3 | C23/50 | 2.17, 2.20 |
| Dissipation Factor @ 10 GHz | IPC TM-650 2.5.5.5 | C23/50 | 0.0009 |
| Dissipation Factor @ 1 MHz | IPC TM-650 2.5.5.3 | C23/50 | 0.0008 |
| Thermal Coefficient of Er (ppm/°C) | IPC TM-650 2.5.5.5
Adapted | -10°C to +140°C | -160 |
| Peel Strength (lbs.per inch) | IPC TM-650 2.4.8 | After Thermal Stress | 14 |
| Volume Resistivity (MΩ-cm) | IPC TM-650 2.5.17.1 | C96/35/90 | 1.4 x 109 |
| Surface Resistivity (MΩ) | IPC TM-650 2.5.17.1 | C96/35/90 | 2.9 x 106 |
| Arc Resistance | ASTM D-495 | D48/50 | >180 |
| Tensile Modulus (kpsi) | ASTM D-638 | A, 23°C | 267, 202 |
| Tensile Strength (kpsi) | ASTM D-882 | A, 23°C | 8.1, 7.5 |
| Compressive Modulus (kpsi) | ASTM D-695 | A, 23°C | 237 |
| Flexural Modulus (kpsi) | ASTM D-790 | A, 23°C | 357 |
| Dielectric Breakdown (kV) | ASTM D-149 | D48/50 | >45 |
| Density (g/cm3) | ASTM D-792 Method A | A, 23°C | 2.23 |
| Water Absorption (%) | MIL-S-13949H 3.7.7
IPC TM-650 2.6.2.2 | E1/105 + D24/23 | 0.02 |
| Coefficient of Thermal | IPC TM-650 2.4.24 | 0°C to 100°C | |
| Expansion (ppm/°C) | Mettler 3000 | |
| X Axis | Thermomechanical | 25 |
| Y Axis | Analyzer | 34 |
| Z Axis | | 252 |
| Thermal Conductivity (W/mK) | ASTM E-1225 | 100°C | 0.261 |
| Outgassing | NASA SP-R-0022A | 125°C, ≤ 10-6 torr | |
| Total Mass Loss (%) | Maximum 1.00% | 0.01 |
| Collected Volatile | Maximum 0.10% | 0.01 |
| Condensable Material (%) | | |
| Water Vapor Regain (%) | | 0.01 |
| Visible Condensate (±) | | NO |
| Flammability UL File E 80166 | UL 94 Vertical Burn IPC TM-650 2.3.10 | C48/23/50, E24/125 | Meets requirements of UL94-V0 |
Benefits
DiClad 880 PCB offers numerous advantages, including an extremely low loss tangent and excellent dimensional stability, which are crucial for high-frequency applications. Its uniform product performance across frequencies ensures consistent electrical properties, providing reliable operation.
The material is chemically resistant, has the lowest moisture absorption among PTFE-based composites, and maintains a stable dielectric constant over a wide frequency range. This low Dk supports wider line widths, resulting in lower insertion loss, making DiClad 880 an exceptional choice for demanding electronic designs.
Specifications
This PCB stackup features a 2-layer rigid design, consisting of a Copper Layer 1 of 35 μm, a DiClad 880 core measuring 1.524 mm (60 mil), and a Copper Layer 2 also at 35 μm.
The board dimensions are 70.28 mm x 139.35 mm, with a tolerance of +/- 0.15 mm. The minimum trace/space is set at 5/8 mils, while the minimum hole size is 0.25 mm.
The finished board thickness is 0.8 mm, and the finished copper weight is 1 oz (1.4 mils) for the outer layers. The via plating thickness is 20 μm, and the surface finish is immersion gold.
For the silkscreen, the top side features a white print, while the bottom side has none. There is no solder mask on either side of the board. Prior to shipment, each PCB undergoes a 100% electrical test to ensure reliability.
| PCB Material: | Woven Fiberglass Reinforced, PTFE-based Composites |
| Designation: | DiClad 880 |
| Dielectric constant: | 2.20 (10 GHz) |
| Dissipation factor | 0.0009 (10 GHz) |
| Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| Dielectric thickness | 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Immersion gold (ENIG), HASL, Immersion silver, Immersion tin, OSP, ENEPIG, Bare Copper, Pure gold plated etc.. |
Standards & Availability
This PCB is supplied in accordance with high-quality standards. The artwork type is Gerber RS-274-X, and it adheres to the IPC-Class-2 standard. This product is available worldwide, making it accessible for a variety of projects.
Typical Applications
The DiClad 880 PCB is well-suited for a range of applications, including:
- Radar feed networks
- Commercial phased array networks
- Low loss base station antennas
- Guidance systems
- Digital radio antennas
- Filters, couplers, and low noise amplifiers (LNAs)
With its advanced features and robust performance, the DiClad 880 PCB stands out as an excellent choice for high-frequency and high-performance electronic applications.
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60mil DiClad 880 PCB 2 Layer Immesion Gold Circuit Board Images
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