In the rapidly advancing world of electronics, the need for high-performance printed circuit boards (PCBs) is paramount. The RT/duroid 6006 PCB stands out as an exceptional solution for microwave and electronic circuit applications, designed specifically to meet the demands of high-frequency environments. This article delves into the features, specifications, and advantages of the RT/duroid 6006, emphasizing its importance in modern circuit design.
Material Composition and Characteristics
The RT/duroid 6006 is a ceramic-PTFE composite that provides outstanding dielectric properties. With a dielectric constant (Dk) of 6.15 ± 0.15 at 10 GHz, it enables significant reductions in circuit size while maintaining performance. This high Dk allows engineers to design compact circuits without compromising functionality.
Key Electrical Properties
Dissipation Factor: The RT/duroid 6006 boasts a low dissipation factor of 0.0027, ensuring minimal signal loss during operation. This characteristic is crucial for applications that demand high efficiency, particularly in RF and microwave circuits.
Thermal Stability: With a thermal stability exceeding 500 °C, the RT/duroid 6006 can withstand extreme temperatures, making it suitable for demanding environments. Its thermal coefficient of dielectric constant is -410 ppm/°C, indicating stable performance across a wide temperature range (-50°C to 170°C).
Moisture Absorption: The PCB exhibits a moisture absorption rate of just 0.05%, enhancing its reliability, especially in humid conditions. This low moisture absorption contributes to the longevity and performance consistency of the circuits.
| Property | RT/duroid 6006 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 6.15±0.15 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped stripline |
| Dielectric Constant,εDesign | 6.45 | Z | | 8GHz to 40 GHz | Differential Phase Length Method |
| Dissipation Factor,tanδ | 0.0027 | Z | | 10 GHz/A | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | -410 | Z | ppm/℃ | -50℃-170℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 7 x 107 | | Mohm.cm | A | IPC 2.5.17.1 |
| Surface Resistivity | 2 x 107 | | Mohm | A | IPC 2.5.17.1 |
| Tensile Properties | ASTM D638 (0.1/min. strain rate) |
| Young's Modulus | 627(91) 517(75) | X Y | MPa(kpsi) | A |
| Ultimate Stress | 20(2.8) 17(2.5) | X Y | MPa(kpsi) | A |
| Ultimate Strain | 12 to 13 4 to 6 | X Y | % | A |
| Compressive Properties | | ASTM D695 (0.05/min. strain rate) |
| Young's Modulus | 1069 (115) | Z | MPa(kpsi) | A |
| Ultimate Stress | 54(7.9) | Z | MPa(kpsi) | A |
| Ultimate Strain | 33 | Z | % | |
| Flexural Modulus | 2634 (382) 1951 (283) | X | MPa(kpsi) | A | ASTM D790 |
| Ultimate Stress | 38 (5.5) | X Y | MPa(kpsi) | A |
| Deformation under load | 0.33 2.1 | Z Z | % | 24hr/50℃/7MPa 24hr/150℃/7MPa | ASTM D261 |
| Moisture Absorption | 0.05 | | % | D48/50℃ 0.050"(1.27mm) thick | IPC-TM-650 2.6.2.1 |
| Thermal Conductivity | 0.49 | | W/m/k | 80℃ | ASTM C518 |
| Coefficient of Thermal Expansion | 47
34
117 | X
Y
Z | ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.41 |
| Td | 500 | | ℃ TGA | | ASTM D3850 |
| Density | 2.7 | | g/cm3 | | ASTM D792 |
| Specific Heat | 0.97(0.231) | | j/g/k
(BTU/ib/OF) | | Calculated |
| Copper Peel | 14.3 (2.5) | | pli (N/mm) | after solder float | IPC-TM-650 2.4.8 |
| Flammability | V-0 | | | | UL 94 |
| Lead-free Process Compatible | Yes | | | | |
Mechanical Properties
The mechanical characteristics of the RT/duroid 6006 further enhance its applicability:
Young's Modulus: With values of 627 MPa in the X-direction and 517 MPa in the Y-direction, the material provides robust mechanical strength.
Ultimate Stress: The ultimate stress values of 20 MPa (X) and 17 MPa (Y) indicate its capacity to withstand significant mechanical loads.
Coefficient of Thermal Expansion (CTE): The CTE values are 47 ppm/°C (X), 34 ppm/°C (Y), and 117 ppm/°C (Z), ensuring dimensional stability across varying temperatures.
PCB Construction and Specifications
This PCB features a well-engineered construction:
Stackup: 2-layer rigid PCB
Copper Layer 1: 35 μm
RT/duroid 6006 Core Thickness: 0.635 mm (25 mil)
Copper Layer 2: 35 μm
Dimensions: 65.33 mm x 59.89 mm (±0.15 mm)
Finished Thickness: 0.7 mm
Surface Finish: Immersion Silver, enhancing solderability and protecting the copper layers.
This PCB supports a minimum trace/space of 5/5 mils and a minimum hole size of 0.5 mm, providing flexibility in design and manufacturing.
Advantages of RT/duroid 6006 PCBs
The RT/duroid 6006 offers a plethora of advantages:
High Dielectric Constant: Facilitates compact designs without sacrificing performance.
Low Loss Characteristics: Ideal for high-frequency applications, ensuring reliable signal transmission.
Reliable Plated Through-Holes: Enhances connectivity and mechanical integrity in multi-layer board designs.
| PCB Material: | Ceramic-PTFE Composites |
| Designation: | RT/duroid 6006 |
| Dielectric constant: | 6.15 |
| Dissipation Factor | 0.0027 10GHz |
| Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 10mil(0.254mm), 25mil (0.635mm), 50mil (1.27mm), 75mil (1.905mm), 100mil(2.54mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. |
Diverse Applications Across Industries
The versatility of the RT/duroid 6006 PCB makes it suitable for various applications, including:
Patch Antennas: Perfect for compact designs in wireless communication.
Satellite Communications Systems: Provides reliable signal transmission in space applications.
Power Amplifiers: Enhances performance in RF and microwave circuits.
Aircraft Collision Avoidance Systems: Critical for safety and reliability in aviation technology.
Ground Radar Warning Systems: Ensures accurate information in defense applications.
Quality Assurance and Standards
Each PCB undergoes rigorous testing, including a 100% electrical test prior to shipment, adhering to IPC-Class-2 standards. This commitment to quality ensures that every unit delivered meets the highest performance criteria.
Conclusion
The RT/duroid 6006 PCB represents a significant advancement in PCB technology, offering unmatched performance for high-frequency applications. Its exceptional dielectric properties, mechanical strength, and reliability make it an essential choice for engineers and designers in various industries. By integrating RT/duroid 6006 into your projects, you can maximize performance, reliability, and efficiency, paving the way for innovation in microwave and electronic circuit design. Explore the possibilities with RT/duroid 6006 and elevate your designs to new heights!
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