Introducing our cutting-edge hybrid PCB, meticulously crafted with a combination of Rogers RO3003 and Shengyi S1000-2M (UL ANSI: FR-4.0) materials. This PCB is designed to excel in commercial microwave and RF applications, offering exceptional performance and reliability in various industries, including automotive radar, advanced driver assistance systems (ADAS), 5G wireless infrastructure, and more.
RO3003 Features:
The RO3003 high-frequency laminates from Rogers provide remarkable stability of dielectric constant (Dk) across a wide range of temperatures and frequencies, eliminating the typical step change in Dk near room temperature found in PTFE glass materials. Key features include:
- Stable Dielectric Constant: With a Dk of 3.00 +/- .04, RO3003 ensures consistent and reliable signal transmission.
- Low Dissipation Factor: The dissipation factor of .0010 at 10 GHz minimizes signal loss, resulting in excellent performance.
- Low CTE: RO3003 exhibits low coefficients of thermal expansion (CTE) on the X, Y, and Z axes, measuring 17, 16, and 25 ppm/°C, respectively.
This ensures excellent mechanical properties and reliability in stripline, multilayer, and hybrid board constructions.
| Property | RO3003 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.0±0.04 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign | 3 | Z | | 8GHz to 40 GHz | Differential Phase Length Method |
| Dissipation Factor,tanδ | 0.001 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | -3 | Z | ppm/℃ | 10 GHz -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | 0.06
0.07 | X
Y | mm/m | COND A | IPC-TM-650 2.2.4 |
| Volume Resistivity | 107 | | MΩ.cm | COND A | IPC 2.5.17.1 |
| Surface Resistivity | 107 | | MΩ | COND A | IPC 2.5.17.1 |
| Tensile Modulus | 930
823 | X
Y | MPa | 23℃ | ASTM D 638 |
| Moisture Absorption | 0.04 | | % | D48/50 | IPC-TM-650 2.6.2.1 |
| Specific Heat | 0.9 | | j/g/k | | Calculated |
| Thermal Conductivity | 0.5 | | W/M/K | 50℃ | ASTM D 5470 |
Coefficient of Thermal Expansion
(-55 to 288℃) | 17
16
25
| X
Y
Z | ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
| Td | 500 | | ℃ TGA | | ASTM D 3850 |
| Density | 2.1 | | gm/cm3 | 23℃ | ASTM D 792 |
| Copper Peel Stength | 12.7 | | Ib/in. | 1oz,EDC After Solder Float | IPC-TM 2.4.8 |
| Flammability | V-0 | | | | UL 94 |
| Lead-free Process Compatible | Yes | | | | |
S1000-2M Features:
The S1000-2M (UL ANSI: FR-4.0) material from Shengyi offers high Tg epoxy glass circuit properties with exceptional performance and manufacturability. Notable features include:
- High Thermal Reliability: With a Tg greater than 180°C, S1000-2M can withstand high temperatures and rapid temperature changes without compromising performance.
- Low CTE (Z-Axis): The material features a low coefficient of thermal expansion (CTE) of 41 ppm/°C before Tg, enhancing dimensional stability and reliability.
- Excellent Electrical Performance: S1000-2M exhibits a permittivity of 4.6 at 1GHz, making it suitable for high multilayer PCB applications.
PCB Construction and Specifications:
This hybrid PCB boasts an 8-layer rigid construction, carefully designed to meet demanding requirements. Here are the key specifications:
- Board Dimensions: The PCB dimensions are precisely maintained at 92.5mm x 130.05mm (2PCS) with a tolerance of +/- 0.15mm.
- Trace/Space and Hole Size: The minimum trace/space is 4/5 mils, allowing for fine routing. The minimum hole size is 0.35mm, accommodating various component requirements.
- Stackup Configuration: The stackup consists of copper layers, Rogers 3003 core, prepreg layers, and Shengyi S1000-2M FR-4 layers, providing optimal performance and reliability.
- Finished Board Thickness and Copper Weight: The finished board thickness is 1.3mm, ensuring durability. The inner layers have a copper weight of 0.5 oz (0.7 mils), while the outer layers have a copper weight of 1oz (1.4mil), enabling efficient conductivity.
- Via Plating and Surface Finish: The via plating thickness is 20μm, ensuring reliable interconnectivity. The surface finish is immersion gold, providing excellent solderability and corrosion resistance.
- Silkscreen and Solder Mask: The top and bottom silkscreens are in white, enhancing component visibility. The top and bottom solder masks are in matte black, offering reliable protection. Silkscreen is not applied to solder pads to avoid interference.
- Electrical Testing and Impedance Control: Each PCB undergoes a comprehensive 100% electrical test to guarantee optimal functionality. The top layer features a 7mil track with 50-ohm single-end impedance, while the 9.5mil/10mil track/gap achieves 100-ohm differential impedance.
Quality, Artwork, and Availability:
This high-frequency PCB complies with IPC-Class-2 quality standards, ensuring reliability and consistent performance. It is compatible with Gerber RS-274-X artwork, allowing for seamless integration into your design workflow. Our product is readily available worldwide, providing easy accessibility to designers and manufacturers seeking top-tier PCB solutions.
Typical Applications:
Our hybrid PCB with RO3003 and S1000-2M materials is ideal for a wide range of applications, including:
- Patch antennas for wireless communications
- Automotive radar systems
- Direct broadcast satellites
- Cellular telecommunications systems, including power amplifiers and antennas
- Datalink on cable systems
Unlock the full potential of your high-frequency applications with our advanced PCB solution. Experience unparalleled performance, reliability, and manufacturability by choosing our hybrid PCB with RO3003 and S1000-2M materials. It's time to elevate your designs to new heights.
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Hybrid PCB RO3003 and High Tg FR-4 1.3mm Multilayer Circuits Impedance Images
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