Rogers RO3210 High Frequency PCB with 25mil and 50mil Coating Immersion Gold, Immersion Tin and Immersion Silver
(PCB's are custom-made products, the picture and parameters shown are just for reference)
Hello Everyone,
Today we’re talking about RO3210 high frequency PCBs.
RO3210 high frequency circuit laminates are ceramic-filled laminates reinforced with woven fiberglass. RO3210 material was designed as an extension of the RO3000 series high frequency circuit materials with one distinguishing characteristic-- improved mechanical stability.
Features and benefits are as follows:
1. Woven glass reinforcement, improves rigidity for easier handling.
2, Uniform electrical and mechanical performance, is ideal for complex multi-layer high frequency structure.
3. Low in-plane expansion coefficient matches to copper, which is reliable for surface mounted assemblies; which is suitable for use with epoxy multi-layer board hybrid designs.
4. Excellent dimensional stability, results in high production yields.
5. Surface smoothness, allows for finer line etching tolerance.
PCB Capability
| PCB Material: | Ceramic-filled Laminates |
| Designation: | RO3210 |
| Dielectric constant: | 10.2 ±0.5 (process) |
| 10.8 (design) |
| Layer count: | 2 Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 25mil (0.635mm), 50mil (1.27mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP etc.. |
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Double layer RO3210 high frequency PCBs are available with 0.5oz to 2oz finished copper, 0.7mm and 1.3mm thick, maximum size 400mm by 500mm, surface finish with bare copper, hot air leveling, immersion gold etc.
Typical applications are:
1. Base station infrastructure
2. LMDS and wireless broadband
3. Power backplanes
4. Remote meter readers
5. Wireless telecommunications systems
The basic colour of RO3210 PCB is white.
The manufacturing process of RO3210 high frequency PCB is similar to standard PTFE PCB, so it’s suitable for volume manufacturing process winning advantageous market.
Data sheet of RO3210 high frequency circuit material
| RO3210 Typical Value |
| Property | RO3210 | Direction | Units | Condition | Test Method |
| Dielectric Constant, ε Process | 10.2±0.5 | Z | | 10 GHz 23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant, ε Design | 10.8 | Z | | 8GHz to 40 GHz | Differential Phase Length Method |
| Dissipation Factor, tanδ | 0.0027 | Z | | 10 GHz 23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | -459 | Z | ppm/℃ | 10 GHz 0℃to 100℃ | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | 0.8 | X, Y | mm/m | COND A | ASTM D257 |
| Volume Resistivity | 103 | | MΩ.cm | COND A | IPC 2.5.17.1 |
| Surface Resistivity | 103 | | MΩ | COND A | IPC 2.5.17.1 |
| Tensile Modulus | 579
517 | MD
CMD | kpsi | 23℃ | ASTM D 638 |
| Water Absorption | ＜0.1 | - | % | D24/23 | IPC-TM-650 2.6.2.1 |
| Specific Heat | 0.79 | | j/g/k | | Calculated |
| Thermal Conductivity | 0.81 | | W/M/K | 80℃ | ASTM C518 |
Coefficient of Thermal Expansion
(-55 to 288℃) | 13
34 | X,Y
Z | ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
| Td | 500 | | ℃ | TGA | ASTM D3850 |
| Density | 3 | | gm/cm3 | | |
| Copper Peel Strength | 11 | | pli | 1oz,EDC After Solder Float | IPC-TM 2.4.8 |
| Flammability | V-0 | | | | UL 94 |
| Lead-free Process Compatible | Yes | | | | |
Product Tags:
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Rogers RO3210 High Frequency PCB With 25mil Coating Immersion Gold Images
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