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Rogers RO3010 High Frequency PCB 50mil Coating Immersion Silver

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Rogers RO3010 High Frequency PCB 50mil Coating Immersion Silver

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Brand Name : Bicheng

Model Number : BIC-097.V1.0

Certification : UL, ISO9001, IATF16949

Place of Origin : CHINA

MOQ : 1PCS

Payment Terms : T/T

Supply Ability : 5000PCS per month

Delivery Time : 8-9 working days

Packaging Details : Vacuum bags+Cartons

Base material : RO3010

Layer count : 2 Layer, Multilayer, Hybrid PCB

PCB thickness : 5mil (0.127mm), 10mil (0.254mm), 25mil (0.635mm), 50mil (1.27mm)

PCB size : ≤400mm X 500mm

Solder mask : Green, Black, Blue, Yellow, Red etc.

Copper weight : 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)

Surface finish : Bare copper, HASL, ENIG, OSP etc..

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Rogers RO3010 High Frequency PCB With 5mil, 10mil, 25mil and 50mil Coating Immersion Silver, Immersion Gold and Tin

(PCB's are custom-made products, the picture and parameters shown are just for reference)

Hello Everyone,

Today we’re talk about RO3010 high frequency PCBs.

RO3010 high frequency circuit laminates are ceramic-filled PTFE composites intended for using in commercial microwave and RF applications. Its obvious characteristic is that the electrical performance is exceptional and the mechanical property is stable and consistent. This allows our designer to develop multi-layer board without encountering warpage or reliability problems.

Rogers RO3010 High Frequency PCB 50mil Coating Immersion Silver

More features and applications are as follows:

1. Excellent mechanical properties versus temperature, it’s reliable stripline and multi-layer board constructions.

2. Uniform mechanical properties, it’s suitable for use with epoxy glass multi-layer board hybrid designs.

3. Low in-plane expansion coefficient matches to copper, it allows for more reliable surface mounted assemblies; ideal for applications sensitive to temperature change and exhibit excellent dimensional stability.

Our PCB Capability (RO3010)

PCB Capability
PCB Material: Ceramic-filled PTFE composite
Designation: RO3010
Dielectric constant: 10. 2 ±0.3 (process)
11.2 (design)
Layer count: 2 Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 5mil (0.127mm), 10mil (0.254mm),
25mil (0.635mm), 50mil (1.27mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..
   

RO3010 high frequency PCBs are available with double sided, multi-layer and hybrid construction, 0.5oz to 2oz finished copper, 0.13 mm to 1.3mm thick, maximum size 400 mm by 500mm, surface finish with bare copper, hot air leveling, immersion gold etc.

Rogers RO3010 High Frequency PCB 50mil Coating Immersion Silver

Typical applications are

1. Automotive radar applications

2. GPS Antennas

3. Power amplifiers and antennas

4. Patch antennas for wireless communications

5. Direct broadcast satellite

Rogers RO3010 High Frequency PCB 50mil Coating Immersion Silver

The basic colour of RO3010 PCB is white.

The manufacturing process of RO3010 high frequency PCB is similar to standard PTFE PCB, so it’s suitable for volume manufacturing process winning advantageous market.

Should you have any questions, please feel free to contact us.

Thank you for your reading.

Appendix: Data Sheet of RO3010

RO3010 Typical Value
Property RO3010 Direction Units Condition Test Method
Dielectric Constant,εProcess 10.2±0.05 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 11.2 Z 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0022 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -395 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.35
0.31
X
Y
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 105 MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 105 COND A IPC 2.5.17.1
Tensile Modulus 1902
1934
X
Y
MPa 23℃ ASTM D 638
Moisture Absorption 0.05 % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.8 j/g/k Calculated
Thermal Conductivity 0.95 W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
13
11
16
X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500 ℃ TGA ASTM D 3850
Density 2.8 gm/cm3 23℃ ASTM D 792
Copper Peel Stength 9.4 Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0 UL 94
Lead-free Process Compatible Yes


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