Introducing the high frequency PCB which is made of Rogers RT/duroid 6006 PCB, a cutting-edge solution for electronic and microwave circuit applications that demand high dielectric constant performance. Engineered with ceramic-PTFE composites, this PCB offers exceptional features and reliability, enabling circuit size reduction and delivering repeatable performance.
The Rogers RT/duroid 6006 laminates are ceramic-PTFE composites designed for electronic and microwave circuit applications requiring a high dielectric constant. They provide high dielectric constants (Dk) to enable circuit size reduction. These materials are low loss, ideal for operating at X-band or below. Additionally, their tight Dk and thickness control deliver repeatable circuit performance.
Key Features:
- Rogers RT/duroid 6006 ceramic-PTFE composites
- Dielectric constant (Dk) of 6.15 +/- 0.15 at 10 GHz/23°C
- Low dissipation factor of 0.0027 at 10 GHz/23°C
- High thermal stability with Td > 500 °C TGA
- Low moisture absorption rate of 0.05%
- Consistent thermal expansion coefficient (CTE): X-axis - 47 ppm/°C, Y-axis - 34 ppm/°C, Z-axis - 117 ppm/°C
- Clad with standard and reverse treated electrodeposited copper foil
The PCB stackup consists of a 2-layer rigid PCB configuration with copper layers on both sides. The copper layer thickness is 35 μm, providing excellent conductivity. The RT/duroid 6006 substrate is 1.27 mm (50mil) thick, offering superior dielectric performance. This construction ensures reliable and efficient circuit operation.
| RT/duroid 6006 Typical Value |
| Property | RT/duroid 6006 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 6.15±0.15 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped stripline |
| Dielectric Constant,εDesign | 6.45 | Z | | 8GHz to 40 GHz | Differential Phase Length Method |
| Dissipation Factor,tanδ | 0.0027 | Z | | 10 GHz/A | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | -410 | Z | ppm/℃ | -50℃-170℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 7 x 107 | | Mohm.cm | A | IPC 2.5.17.1 |
| Surface Resistivity | 2 x 107 | | Mohm | A | IPC 2.5.17.1 |
| Tensile Properties | ASTM D638 (0.1/min. strain rate) |
| Young's Modulus | 627(91) 517(75) | X Y | MPa(kpsi) | A |
| Ultimate Stress | 20(2.8) 17(2.5) | X Y | MPa(kpsi) | A |
| Ultimate Strain | 12 to 13 4 to 6 | X Y | % | A |
| Compressive Properties | | ASTM D695 (0.05/min. strain rate) |
| Young's Modulus | 1069 (115) | Z | MPa(kpsi) | A |
| Ultimate Stress | 54(7.9) | Z | MPa(kpsi) | A |
| Ultimate Strain | 33 | Z | % | |
| Flexural Modulus | 2634 (382) 1951 (283) | X | MPa(kpsi) | A | ASTM D790 |
| Ultimate Stress | 38 (5.5) | X Y | MPa(kpsi) | A |
| Deformation under load | 0.33 2.1 | Z Z | % | 24hr/50℃/7MPa 24hr/150℃/7MPa | ASTM D261 |
| Moisture Absorption | 0.05 | | % | D48/50℃ 0.050"(1.27mm) thick | IPC-TM-650 2.6.2.1 |
| Thermal Conductivity | 0.49 | | W/m/k | 80℃ | ASTM C518 |
| Coefficient of Thermal Expansion | 47
34
117 | X
Y
Z | ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.41 |
| Td | 500 | | ℃ TGA | | ASTM D3850 |
| Density | 2.7 | | g/cm3 | | ASTM D792 |
| Specific Heat | 0.97(0.231) | | j/g/k
(BTU/ib/OF) | | Calculated |
| Copper Peel | 14.3 (2.5) | | pli (N/mm) | after solder float | IPC-TM-650 2.4.8 |
| Flammability | V-0 | | | | UL 94 |
| Lead-free Process Compatible | Yes | | | | |
The PCB construction details include a board dimension of 197mm x 154mm, available in two types, with a tolerance of +/- 0.15mm. The minimum trace/space allows for precise designs with a minimum of 6/5 mils. The PCB can accommodate components with a minimum hole size of 0.3mm. It does not utilize blind vias, simplifying the manufacturing process. The finished board thickness is 1.4mm, providing durability. The outer layers feature a 1 oz (1.4 mils) copper weight for optimal conductivity. The via plating thickness is 20 μm, ensuring robust connections. The surface finish is coated with immersion gold for excellent conductivity and protection. The top silkscreen is labeled in black ink for clear component identification, while the bottom side does not have a silkscreen. The top and bottom solder masks are green, enhancing soldering and protection. Each PCB undergoes a comprehensive 100% electrical test prior to shipment to ensure quality.
The PCB statistics showcase its capabilities, with the ability to accommodate up to 19 components and a total of 72 pads, allowing for efficient connectivity and integration. Of the pads, 37 are dedicated to through-hole components, ensuring secure connections. The top side features 35 surface mount technology (SMT) pads for efficient assembly, while the bottom side does not have SMT pads. The PCB includes 38 vias, facilitating efficient signal routing and interconnection between layers. It supports 5 nets for organized and optimized signal flow within the circuitry.
The Rogers RT/duroid 6006 PCB is available worldwide and adheres to the accepted standard of IPC-Class-2. It finds typical applications in patch antennas, satellite communication systems, power amplifiers, aircraft collision avoidance systems, and ground radar warning systems.
Experience the outstanding performance and reliability of the Rogers RT/duroid 6006 PCB, designed to unlock the full potential of your high-frequency designs.
Product Tags:
|
|
50mil RT duroid 6006 High Frequency PCB with Black Silkscreen and Immersion Gold Images
|
