Today, we are happy to share our newly shipped PCB based on RO3010 materials.
1. RO3010 Introduction:
Rogers RO3010 laminates are advanced circuit materials that utilize ceramic-filled PTFE composites. These laminates offer a higher dielectric constant with excellent stability. They are competitively priced products known for their exceptional mechanical and electrical stability, making them suitable for a wide range of applications across various frequencies. RO3010 laminates simplify the design of broadband components and are particularly well-suited for circuit miniaturization.
2. Features:
RO3010 laminates are composed of ceramic-filled PTFE composites. They exhibit a dielectric constant of 10.2 +/- 0.30 at 10 GHz and 23°C, along with a low dissipation factor of 0.0022 at the same frequency and temperature. With a low coefficient of thermal expansion ranging from 13 ppm/°C to 16 ppm/°C (-55 to 288 °C) in the X, Y, and Z axes, RO3010 laminates demonstrate excellent dimensional stability. They have a high thermal decomposition temperature exceeding 500°C and a thermal conductivity of 0.95 W/mK. RO3010 laminates also boast a low moisture absorption rate of 0.05% and can operate in the temperature range of -40℃ to +85℃.
| RO3010 Typical Value |
| Property | RO3010 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 10.2±0.05 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign | 11.2 | Z | | 8GHz to 40 GHz | Differential Phase Length Method |
| Dissipation Factor,tanδ | 0.0022 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | -395 | Z | ppm/℃ | 10 GHz -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | 0.35
0.31 | X
Y | mm/m | COND A | IPC-TM-650 2.2.4 |
| Volume Resistivity | 105 | | MΩ.cm | COND A | IPC 2.5.17.1 |
| Surface Resistivity | 105 | | MΩ | COND A | IPC 2.5.17.1 |
| Tensile Modulus | 1902
1934 | X
Y | MPa | 23℃ | ASTM D 638 |
| Moisture Absorption | 0.05 | | % | D48/50 | IPC-TM-650 2.6.2.1 |
| Specific Heat | 0.8 | | j/g/k | | Calculated |
| Thermal Conductivity | 0.95 | | W/M/K | 50℃ | ASTM D 5470 |
Coefficient of Thermal Expansion
(-55 to 288℃) | 13
11
16 | X
Y
Z | ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
| Td | 500 | | ℃ TGA | | ASTM D 3850 |
| Density | 2.8 | | gm/cm3 | 23℃ | ASTM D 792 |
| Copper Peel Stength | 9.4 | | Ib/in. | 1oz,EDC After Solder Float | IPC-TM 2.4.8 |
| Flammability | V-0 | | | | UL 94 |
| Lead-free Process Compatible | Yes | | | | |
3. Benefits:
One of the notable benefits of RO3010 laminates is their dimensional stability, with the expansion coefficient matched to that of copper. This characteristic enhances the reliability and performance of the laminates. Additionally, RO3010 laminates are cost-effective, thanks to their economical laminate pricing resulting from a volume manufacturing process. They are also suitable for use in multi-layer board designs, providing flexibility in various applications.
4. PCB Stackup:
For this 2-layer rigid PCB, the stackup consists of a copper layer with a thickness of 35 μm, followed by the RO3010 substrate with a thickness of 10mil (0.254mm), and another copper layer with a thickness of 35 μm.
5. PCB Construction Details:
This PCB has a board dimensions of 80.1mm x 56.74 mm for a single piece. The minimum trace/space is 4/4 mils, and the minimum hole size is 0.3mm. There are no blind vias in this configuration. The finished board thickness is 0.37mm, and the outer copper layers have a weight of 1 oz (1.4 mils). The via plating thickness is 20 μm. The surface finish is immersion gold, and the top silkscreen is white, while no silkscreen or solder mask is applied to the bottom layer. A 100% electrical test is conducted to ensure the quality of the PCB before shipment.
6. PCB Statistics:
This PCB includes 24 components and a total of 71 pads. Among these pads, 51 are through-hole pads, and 23 are top surface-mount technology (SMT) pads. There are no bottom SMT pads. The design features 67 vias and consists of 3 nets.
7. Supplied Artwork Type: Gerber RS-274-X
8. Accepted Standard: IPC-Class-2
9. Availability: RO3010 laminates are available worldwide, ensuring accessibility for various markets.
10. Typical Applications:
RO3010 PCBs find application in a wide range of industries and products. They are particularly suitable for automotive radar applications, global positioning satellite antennas, cellular telecommunications systems (including power amplifiers and antennas), patch antennas for wireless communications, direct broadcast satellites, cable systems for data link, remote meter readers, and power backplanes. The exceptional electrical and mechanical properties of RO3010 laminates make them reliable and versatile for these applications.
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10mil RO3010 Double Sided Printed Circuit Boards With Immersion Gold Images
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