The Future is Now: Rogers RT/duroid 5880
We are proud to introduce our latest PCB made of Rogers RT/duroid 5880, a ceramic-filled PTFE composite material that is ideal for high-frequency applications.
With a base copper thickness of 17um, dielectric thickness of 31mil, and a finished board thickness of 0.96mm, this board is perfect for a variety of applications. It has a minimum trace/space of 6/7 mils, a minimum hole size of 15 mils, and no blind or buried vias. The board dimensions are 56.00 x 20.00 mm with a tolerance of +/- 0.15mm.
This PCB board also comes with 100% electrical testing, ensuring that it meets the highest quality standards. The finished Cu weight is 1 oz (1.4 mils) on all layers, and the via plating thickness is 1 mil. The surface finish is HASL Lead free, and the top silkscreen is white.
In terms of statistics, this PCB board has 31 components, 89 total pads, 62 thru hole pads, 12 top SMT pads, 15 bottom SMT pads, 60 vias, and 76 nets. Panelized solder paste stencils are supplied for both the top and bottom sides, making it easy to use for your specific needs.
For technical questions or concerns, please don't hesitate to contact Ivy at sales10@bichengpcb.com. Thank you for considering our newly shipped PCB board from Bicheng Limited.
The Advantages of Using Rogers RT/duroid 5880 PCB Material
-------Introduction to Rogers RT/duroid 5880 PCB Material
Rogers RT/duroid 5880 has been gaining popularity as a high-performance, low-loss PCB material with excellent thermal stability. In this comprehensive guide, we will explore the materials' specifications, benefits, and applications.
Introduction to Rogers RT/duroid 5880 PCB Material
Rogers RT/duroid 5880 is a ceramic-filled PTFE composite material that is suitable for high-frequency applications, especially those that require high thermal stability. The material can operate between -40°C to +85°C, and it is designed with excellent dimensional stability and mechanical strength.
Properties and Specifications of Rogers RT/duroid 5880 PCB Material
Rogers RT/duroid 5880 has a dielectric constant of 2.2 and a dissipation factor of 0.0004 at 1 MHz. It also has a thermal coefficient of ε of -125 ppm/℃ and a volume resistivity of 2 x 10^7 Mohm cm. The material's specific heat is 0.96 j/g/k, and it has a tensile modulus of 1070 MPa at 23℃ and 450 MPa at 100℃.
| RT/duroid 5880 Typical Value |
| Property | RT/duroid 5880 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 2.20
2.20±0.02 spec. | Z | N/A | C24/23/50
C24/23/50 | 1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5 |
| Dielectric Constant,εDesign | 2.2 | Z | N/A | 8GHz to 40 GHz | Differential Phase Length Method |
| Dissipation Factor,tanδ | 0.0004
0.0009 | Z | N/A | C24/23/50
C24/23/50 | 1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5 |
| Thermal Coefficient of ε | -125 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 2 x 107 | Z | Mohm cm | C/96/35/90 | ASTM D 257 |
| Surface Resistivity | 3 x 107 | Z | Mohm | C/96/35/90 | ASTM D 257 |
| Specific Heat | 0.96(0.23) | N/A | j/g/k
(cal/g/c) | N/A | Calculated |
| Tensile Modulus | Test at 23℃ | Test at 100℃ | N/A | MPa(kpsi) | A | ASTM D 638 |
| 1070(156) | 450(65) | X |
| 860(125) | 380(55) | Y |
| Ultimate Stress | 29(4.2) | 20(2.9) | X |
| 27(3.9) | 18(2.6) | Y |
| Ultimate Strain | 6 | 7.2 | X | % |
| 4.9 | 5.8 | Y |
| Compressive Modulus | 710(103) | 500(73) | X | MPa(kpsi) | A | ASTM D 695 |
| 710(103) | 500(73) | Y |
| 940(136) | 670(97) | Z |
| Ultimate Stress | 27(3.9) | 22(3.2) | X |
| 29(5.3) | 21(3.1) | Y |
| 52(7.5) | 43(6.3) | Z |
| Ultimate Strain | 8.5 | 8.4 | X | % |
| 7.7 | 7.8 | Y |
| 12.5 | 17.6 | Z |
| Moisture Absorption | 0.02 | N/A | % | 0.62"(1.6mm) D48/50 | ASTM D 570 |
| Thermal Conductivity | 0.2 | Z | W/m/k | 80℃ | ASTM C 518 |
| Coefficient of Thermal Expansion | 31
48
237 | X
Y
Z | ppm/℃ | 0-100℃ | IPC-TM-650 2.4.41 |
| Td | 500 | N/A | ℃ TGA | N/A | ASTM D 3850 |
| Density | 2.2 | N/A | gm/cm3 | N/A | ASTM D 792 |
| Copper Peel | 31.2(5.5) | N/A | Pli(N/mm) | 1oz(35mm)EDC foil
after solder float | IPC-TM-650 2.4.8 |
| Flammability | V-0 | N/A | N/A | N/A | UL 94 |
| Lead-free Process Compatible | Yes | N/A | N/A | N/A | N/A |
Benefits of Using Rogers RT/duroid 5880 PCB Material
The low-loss characteristics of Rogers RT/duroid 5880 make it ideal for high-frequency applications. The material also has high thermal stability, making it capable of withstanding high temperatures without losing its properties. Rogers RT/duroid 5880 is an environment-friendly and lead-free material, which is compliant with RoHS regulations.
Applications of Rogers RT/duroid 5880 PCB Material
Rogers RT/duroid 5880 is a versatile material that can be used in several applications, including RF and microwave circuits, high-speed digital circuits, and aerospace and defense applications. The material's high reliability and performance make it an excellent choice for demanding electronic devices.
Design Considerations for Rogers RT/duroid 5880 PCB Material
When designing with Rogers RT/duroid 5880, it is essential to consider the material's electrical and mechanical properties. The material's low-loss characteristics mean that it has a narrower bandwidth than other PCB materials. Additionally, because it is a ceramic-filled PTFE composite, it is more brittle than other materials and requires special care to avoid mechanical stress during manufacturing.
Manufacturing Process of Rogers RT/duroid 5880 PCB Material
The manufacturing process for Rogers RT/duroid 5880 is similar to that of other PCB materials. The material is typically supplied in sheets, and the PCB is etched using standard processes. Panelized solder paste stencils are supplied for the top and bottom sides, making it easy to use for specific needs.
Testing and Quality Control of Rogers RT/duroid 5880 PCB Material
Rogers RT/duroid 5880 undergoes rigorous testing and quality control to ensure that thematerial meets the highest quality standards. The material is tested for its dielectric constant, dissipation factor, thermal coefficient, volume resistivity, and more. Additionally, 100% electrical testing is used to ensure that the finished product meets the required specifications.
Comparison with Other PCB Materials
Compared to other PCB materials, Rogers RT/duroid 5880 has several advantages. Its low-loss characteristics make it ideal for high-frequency applications, and its high thermal stability means that it can withstand high temperatures without losing its properties. Additionally, it is an environment-friendly and lead-free material, making it compliant with RoHS regulations.
Lead-Free Process in Rogers RT/duroid 5880 PCB Material
Rogers RT/duroid 5880 is a lead-free material, which means that it is an environmentally friendly and sustainable option for PCB design. The lead-free process also has several benefits, including improved reliability, longevity of the PCB, and reduced manufacturing costs.
Future of Rogers RT/duroid 5880 PCB Material
As the demand for high-performance and environment-friendly PCB materials continues to grow, Rogers RT/duroid 5880 is poised to become a leading choice for PCB designers. With its low-loss characteristics, high thermal stability, and lead-free process, it is well-suited for a wide range of applications. As research and development continue in the electronics industry, Rogers RT/duroid 5880 is expected to play an important role in the future of PCB design.
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2 Layer High Frequency PCB Based On 31 Mil Rogers RT/Duroid 5880 Substrates Images
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