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RO4003C Via Filled PCB Low DK For RF Applications

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RO4003C Via Filled PCB Low DK For RF Applications

RO4003C Via Filled PCB Low DK For RF Applications

Today's PCB sharing is a via filled by resin and capped PCB. Made from RO4003C hydrocarbon ceramic laminates, this PCB is ideal for use in a variety of applications. With a lead-free process and -40℃ ...

Product Tags:

Low DK RF PCB

      

Via Filled PCB

      

RO4003C RF PCB Board

      
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